About the Conference
Excellence in Electronics
The IEEE Electronics Packaging Society (EPS) presents this premier international conference, bringing together the brightest minds in electronics packaging technology from around the globe.
Global Networking
Connect with researchers, practitioners, and industry leaders. Share insights, discover innovations, and build partnerships that will shape the future of electronics packaging.
Important Dates
Mark your calendars for these crucial milestones
Call for Papers Launched
July 15, 2025
Submission Portal Opens
July 15, 2025
Submission Deadline
October 17, 2025
Author Notifications
December 19, 2025
Camera Ready Due
January 23, 2026
Conference Dates
March 2-3, 2026
Conference Tracks
Electronics & Packaging Technologies: Bridging Skills & Innovation for India's Industry
Advanced Packaging Technologies
- • Heterogeneous Integration and SiP
- • Fan-Out Wafer-Level Packaging
- • 3D IC and Through-Silicon Vias
- • Advanced Substrates and Interposers
Materials and Processes
- • Advanced High-Performance Materials
- • Thermal Interface Materials
- • Soldering & Encapsulation Materials
- • Additive Manufacturing & 3D Printing
Reliability and Testing
- • Failure Analysis & Reliability Testing
- • Mechanical & Thermal Stress Testing
- • Advanced Metrology for Packaging
- • AI-Driven Reliability Models
Power and RF Packaging
- • Power Electronics & Thermal Management
- • High-Frequency & RF Applications
- • Wide Bandgap Semiconductors (SiC, GaN)
- • EMI Shielding Solutions
Emerging Applications
- • IoT and Wearable Devices
- • Quantum Computing Packaging
- • Automotive & Aerospace Packaging
- • Biocompatible & Medical Devices
Sustainable & Green Packaging
- • Eco-Friendly Materials & Processes
- • Recyclability & Circular Economy
- • Low-Carbon Manufacturing
- • Lifecycle Assessment Solutions
Advanced Interconnects
- • High-Density Interconnects
- • Flexible & Stretchable Electronics
- • Optical & Photonic Integration
- • Wireless Interconnects & Antennas
Thermal & Mechanical
- • Heat Dissipation in High-Density Packaging
- • Modeling & Simulation of Stress
- • Thermal Interface Materials
- • High-Performance Cooling Solutions
AI, ML & Digital Twin
- • AI-Driven Design & Optimization
- • Machine Learning for Predictive Analysis
- • Digital Twins for Design & Testing
- • Automation & Robotics in Packaging
Industry Trends & Standards
- • Standardization in Packaging Processes
- • Academia-Industry Collaboration
- • Future Trends in Semiconductor Packaging
- • Industry Innovation Case Studies
Contact Information
Get in touch with our organizing committee
Conference Chair
General Inquiries
Prof. (Dr.) Ashwini Kumar Aggarwal
Professor of Practice, MRIIRS
Founder & Chair, IEEE EPS NCR Chapter
Conference Co-Chair
Primary Contact
Dr. Umesh Dutta
CEO MRIIF & Associate Professor
Department of ECE
Venue Location
Conference Venue